National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates

Is this a Limited Submission?

Yes, this is a Limited Submission

There are special requirements to apply for this opportunity, since the sponsor limits how many applicants may apply per institution. You will need to submit an NOI and/or Pre-Proposal for review by a Campus Committee before applying.

See this page for more information

Limited Submission - Application Link(s):

Campus LOI Deadline

Campus Pre-Proposal Deadline

Sponsor - Preliminary Proposal Deadline

Application Deadline

Key Information

Direct Link to Opportunity

https://www.nist.gov/system/files/documents/noindex/2024/02/27/CHIPS%20NAPMP%20MATERIALS%20AND%20SUBSTRATES%20NOFO%20%281%29-508C.pdf

Application Deadline

Fund Type

Grant

Funding Agency

NIST/DOC

Agency Type

Non-Federal

Internal or External

External

Status of Applicants

See Opportunity Website

Discipline(s)

See Opportunity Website

Contact

See Opportunity Website

Additional Details

Date Posted: