National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates
Is this a Limited Submission?
Yes, this is a Limited Submission
There are special requirements to apply for this opportunity, since the sponsor limits how many applicants may apply per institution. You will need to submit an NOI and/or Pre-Proposal for review by a Campus Committee before applying.
See this page for more information
Limited Submission - Application Link(s):
Campus LOI Deadline
Campus Pre-Proposal Deadline
Sponsor - Preliminary Proposal Deadline
Application Deadline
Key Information
Direct Link to Opportunity
https://www.nist.gov/system/files/documents/noindex/2024/02/27/CHIPS%20NAPMP%20MATERIALS%20AND%20SUBSTRATES%20NOFO%20%281%29-508C.pdfApplication Deadline
Fund Type
Grant
Funding Agency
NIST/DOC
Agency Type
Non-Federal
Internal or External
External
Status of Applicants
See Opportunity Website
Discipline(s)
See Opportunity Website
Contact
See Opportunity Website